View PC354_146022.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

PREPARED
BY:
DATE:
SHA
APPROVED
BY: DATE: ELECTRONIC COMPO GROUP SHARP CORPORATION
I SPEC.
No.
ED-9466 October
1B 29. 1999
SPECIFICATION
DEVICE SPECIFICATION FOR Business
I
I I
OF'TO-ELECT=
dealing
name
PHOTOCOUPLER
I
MODEL
No.
PC354
1. These speciilcation sheets include materials protected under copyright of Sharp Corporation Please do not reproduce or cause anyone to reproduce them without Sharp's consent.
(`Sharp").
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This product is designed for use in the following application areas : Audio visual equipment OA equipment * Home appliances . Telecommunication equipment (Terminal) * Measuring equipment Computers 1 Tooling machines If the use of the product in the above application areas is for equipment listed in paragraphs (21 or (31, please be sure to observe the precautions given in those respective paragraphs.
l l l l
1
(21 Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.) * Tram signals * Gas leakage sensor breakers * Rescue and security equipment Other safety equipment [
l
(31 Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as : * Space equipment * Telecommunication equipment (for trunk lines) * Nuclear power control equipment * Medical equipment [
1
1
(4) Please contact and consult with a Sharp sales representative regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative
if there are any questions about this product.
for any questions DATE PRESENTED BY
CUSTOMERS
APPROVAL
;(i
4
DATE BY
K. Hachimura. Department General Manager Engineering Dept. ,I1 Opto-Electronic Devices Div. ELECOM Group SHARP CORPORATION
of
SHARP CORPORATION
ED-94(
1. Application This specification applies Model No. PC354. to the outline and characteristics of p
2. Outline Refer to the attached drawing No. CY6488KO2.
3. Ratings
and characteristics sheet, page 4 to 6.
Refer to the attached
4. Reliability Refer to the attached sheet, page 7.
5.
Incoming
inspection sheet, page 8.
Refer to the attached
6. Supplement 6.1 Isolation voltage shall be measured in the following method. side and between
(1) Short between anode and cathode on the primary collector and emitter on the secondary side. (2) The dielectric withstand tester voltage with zero-cross
circuit
shall be used.
(3) The wave form of applied
shall be a sine wave.
6.2
Packaging
specifications
SHARPCORPORATION
6.3 Collector current (Ic) Delivery rank table ("0" mark : indicates business dealing name of ordered Rank at delivery 8 Business dealing name PC354NT PC354N 1T Rank mark
product) Test conditions I,=+ 1mA V ca=5v Ta=25C
Ic b-M 0.2 to 4.0 0.5 to 1.5
A or no mark A
6.4 This Model is approved Approved Model
by UL.
No. : PC354
UL file No. : E64380
6.5 This product 6.6 This product This product This product 6.7 ODS materials
is AC input
type. against irradiation. input and output. diode.
is not designed is operated incorporates
with electrical non-coherent
light emitting
This product shall not contain the following materials. Also, the following materials shall not be used in the production for this product. Materials for ODS : CFC,, Halon. Carbon 1.1.1 -Trichloroethane tetrachloride. (Methylchloroform)
process
6.8 Brominated
flame retardants such as the PBBO, and PBB, are not used
Speciiic brominated flame retardants in this device at all.
7. Notes Refer to the attached sheet- 1- 1, 2.
SHARP CORPORATION
2. Outline i
0
.
c @
3.6kO. 3
;
2.54kO.25
i / Date code
Pin Nos. and internal connection diagram
Sharp mark "S",
\,
1
Model No. \ Primary side mark \
. .
\*
d
Anode (Cathode)
0
3 Collector
0 Cathode (Anode)
3 Emitter
&nk mark
mark
Epoxy resin +q=, g
4-L
6"
*l) 2-digit number shall be marked according to DIN standard. *2) Factory identification mark shall be or shall not be marked. UNIT: l/l mm *3) Rank mark : "A" or no mark
l 4) Marking is laser marking
Product mass : Approx. 0. lg Name Drawing No.
L
PC354 Outline Dimensions (Business dealing name : PC354NT) CY6488KO2
SHARP CORPORATION
3. Ratings
and characteristics maximum ratings
3.1 Absolute
Input
output Collector current
* 1 Total power dissipation Operating temperature Topr Tstg Viso(rms) Tsol maximum ratings -30 to +lOO -40 to +125 3.75 260 due to ambient temperature `C "C kV %
Storage temperature *3 Isolation *4 Soldering voltage temperature
* 1 The derating factors of absolute are shown in Fig. 1 to 4. *2 Pulse widths
100 /1 s. Duty ratio : 0.00 1 (Refer to Fig. 51 f=GOHz
*3 AC for 1 min. 40 to 6O%RH, *4 For 10s
SHARP CORPORATION
3.2 Electra-optical
characteristics
Parameter Forward voltage Input Terminal capacitance
Symbol VF Ct I,
EO
Conditions 1,=+2omA v=o, f=lkHz vc,=2ov, Ic=O. 1mA I,=0 I,= 10 rA, I,=0 1,=+1mA, 1,=+2omA Ic=lmA DCSOOV 40 to 6O%RH V=O, f= 1MHz VcE=2V ' Ic=2mA Iq=lOOQ vc,=5v IF0
MIN.
m. 1.2 30
MAX. 1.4 250 100
uni; v pF nA V
Dark current Collector-emitter breakdown voltage Emitter-collector breakdown voltage Collector current
BvCEO
35
-
-
output
BVECO
6 0.2
0.1
4.0 0.2
V mA v
IC
Collector-emitter saturation voltage Transfer characteristics Isolation resistance
`CE(sat)
Riso
5XlO'O
10"
-
Q
Floating Response Response
capacitance time time Rise Fall
Cf tr tf
0.6 4 3
1.0 18 18
pF ps ps
SHARP CORPORATION
(Fig. 1) Forward ambient
current vs. temperature
c
80
3 g z ;ij
70 60 40 20 O -30
b 3
g 3 .2 n -30 0 Ambient 25 55 75 100 Ta ("C) 125 temperature
0
25
100 125 Ta ("C)
Ambient temperature
(Fig. 3) Collector power dissipation vs. ambient temperature
(Fig. 4) Total power dissipation vs. ambient temperature
g s .9 2 ;ij
170 150 100
-30
0 Ambient
25
50
75
100 Ta ("C)
125
F
-30
0
25
50
75
100 125 Ta ("C)
temperature
Ambient temperature
3
(Fig. 5) Peak forward current vs. duty ratio Pulse widths Ta=25"C 100 p s
a"
Duty ratio
SHARP CORPOMTION
4. Reliability The reliability of products items listed below. Test Items shall satisfl Test Conditions *1 Solderability Soldering heat *2 *3 23O'C. 5 s 26O'C. 10s Weight : 1N 1 time/each terminal 150OOm/s*, 3 times/+X, 0.5ms +Y. +Z direction v,>ux
kEO>UX2
Confidence level : 90% LTPD : 100/o/20% Failure Judgement Criteria n=ll. n=ll, 1.2 n=ll. n=ll. Icux 1.2 n=ll. C=O C=O C=O C=O C=O
Terminal strength (Bending) *4 Mechanical Variable vibration shock frequency
100 to 2000 to lOOHz/4min 200m/s* 4 times/ X, Y. 2 direction 1 cycle -40C to + 125'C (30min) (30min) 20 cycles test +85-C. 85%RH. 500h
Temperature cycling
High temp. and high humidity storage *5 High temp. storage Low temp. Operation storage life
U : Upper specification limit L : Lower specification limit
+125-C.
lOOOh
`I
n=22.C=0 n=22.C=0 n=22,C=O n=22.C=0 n=22,C=O H
0.2mm or more
-4O'C. lOOOh 1,=+5OmA. Ptot= 170mW Ta=25'C, lOOOh conforms to EIAJ ED 470 1.
* 1 Test method,
*2 Solder shall adhere at the area of 95% or more of immersed portion of lead, and pin hole or other holes shall not be concentrated on one portion.
l 3 The lead pin depth
root of lead pins.
dipped
direction
washing
into solder shall be 0.2mm
is shown below.
solvent
away from the
*4 Terminal
`5
bending
after
It in ~vall~at~rl
hv specified
in attach
sheet-
l- 1. 2.
+ Weight : 1N
Soldering a~
SHARP CORPORATION
5. Incoming
inspection items characteristics V,,(,,). Ic, Rise. Viso
5.1 Inspection (1) Electrical V,, I,,,, (2) Appearance
5.2 Sampling
method
and Inspection
level
A single sampling plan, normal inspection level II based on IS0 2859 is applied. The AQL according to the inspection items are shown below. Inspection item AQL (O/o)
Defect Major defect Minor defect
Electrical characteristics Unreadable marking Appearance defect except the above mentioned.
0.1
0.4
SHARP CORPORATION
6.2
Package 6.2.1
specifications conditions and Dimensions (Refer to the attached sheet, Page 10) on
Taping
(1) Tape structure
The tape shall have a structure in which a cover tape is sealed heat-pressed the carrier tape of protect against static electricity. (2) Reel structure and Dimensions (Refer to the attached its dimensions sheet, Page 11)
The taping reel shall be of plastic with as shown in the attached drawing. (3) Direction of product insertion
(Refer to the attached
sheet,
Page 11) at the
Product direction in carrier hole side on the tape. (4) Joint of tape
tape shall direct
to the anode mark
The cover tape and carrier (5) The way to repair
tape in one reel shall be jointless. devices devices cut a bottom of carrier tape with a cutter, and the cut portion shall be sealed with adhesive tape.
taped failure
The way to repair taped failure after replacing to good devices, 6.2.2 Adhesiveness of cover tape
. The exfoliation force between carrier tape and cover tape shall be 0.2N to 0.7N for the angle from 160' to 180' . 6.2.3 Rolling
l
method
and quantity
Wind the tape back on the reel so that the cover tape will be outside the tape. Attach more than 20cm of blank tape to the trailer and the leader of the tape and fur the both ends with adhesive tape. One reel shall contain 750~~s.
6.2.4
Marking . The outer
l
packaging * Number
case shall be marked of pieces delivered
with
l
following
information. date
Model No. condition
Production
6.2.5
Storage
l
Taped products shall be stored at the temperature 5 and 30C and the humidities lower than 7O%RH. protection during shipping
between
6.2.6
Safety
l
There shall be no deformation of component characteristics due to shipping.
or degradation
of electrical
SHARP CORPORATION
Carrier
tape structure
and Dimensions
t
F
I.-E I-
I_ -I-
D
i
5" max
Symbol
A
\unit
B ~
f0.05 5.5
C
+o. 1
D
kO.1
f0.3
mm
12.0
1.75
8.0
Symbol
F
\ Unit mm
kO.1
G
+o. 1 -0.0
H
kO.1
4.0
$J3 1.5
7.4
-II J
-Lo.05 -to.1
-1
E
kO.05
2.0
K
kO.1
0.3
3.1
4.0
SHARP CORPORATION
Reel structure
and Dimensions
e
.
3
C
f a ' b
Check word a b 113.5S.51
C
I
d
I
e
I
f
I
mm
1
180
8Okl.O
1 13f0.5
1 21fl.O
1 2.OkO.5
g I 12.0f0.5
1
Direction
of product
insertion
Pull-out
direction
SHARP CORPORATION
Precautions
for Photocouplers
1 For cleaning (1) Solvent (2) Ultrasonic cleaning 45C or less : Solvent temperature Immersion for 3 min or less : The effect to device by ultrasonic cleaning differs by cleaning bath size, ultrasonic power output, cleaning time, PCB size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning. : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol
cleaning
(3) Applicable
solvent
In case when the other solvent is used, there are cases that the packaging resin is eroded. Please use the other solvent aiter thorough confirmation is performed in actual using condition. 2. The LED used in the Photocoupler generally decreases the light emission power by operation. In case of long operation time, please design the circuit with considering the degradation of the light emission power of the LED. (50%/5years)
3. There are cases that the deviation of the CTR and the degradation of the LED become big at IF is less than l.OmA. Please design the circuit with considering this point.
of the light emission
power
SHARP CORPORATION
h-9406
11
4. Precautions for Soldering Photocouplers (1) If solder reflow : It is recommended that only one soldering be done at the temperature and the time within the temperature profile as shown in the figure below.
25C
amin
+I+ 30 s
<
lmin
<
lmin
1.5 min
>
Since, influence to the device is different according to reflow equipment and its condition, please use the device after confirming no damage in the actual using condition.
(2) Other precautions An infrared lamp used to heat up for soldering may cause a localized temperature rise in the resin. So keep the package temperature within that specified in Item (1). Also avoid immersing the resin part in the solder.

▲Up To Search▲

Price & Availability of PC354

	To Download PC354 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .